The probe

Why use probe CARDS?

Semiconductor process technology has advanced rapidly in recent years, several years ahead of Moore's law estimates, and is now well below 32 nanometers. At present, the products are light and short, with smaller and smaller IC volume, stronger and stronger functions and more and more feet. In order to reduce the area occupied by Chip packaging and improve IC efficiency, Flip Chip packaging is widely used in graphics Chip, chipset, memory and CPU. The above high-order packaging method has a high unit price. If the chip is tested before packaging and the defective products are found in the wafer, the defective products marked are marked and discarded until the later packaging process, the unnecessary packaging cost can be saved.

Main purpose of probe card:

The probe on the probe card is directly contacted with the welding pad or bump on the chip, leading to the chip signal, and then cooperating with the peripheral testing instrument and software control to achieve the purpose of automatic measurement. Probe card is applied before IC is packaged. Functional test is carried out with probe for naked crystal system to screen out defective products and carry out packaging engineering afterwards. Therefore, probe card is one of the most important processes in IC manufacturing which has a great impact on manufacturing cost.